- Description
- Options
- Consultation
High Throughput
Plasma Etching and deposition modules can be combined with up to two cassette stations for high throughput processing of up to 200 mm wafers.
Research & Development
Tree to six port transfer chambers are available for clustering ICP plasma etchers, RIE etchers, atomic layer deposition systems, PECVD and ICPEC deposition tools to meet the requirements of R & D. Samples can be loaded via vacuum loadlock and / or vacuum cassette station.
SENTECH cluster tools comprise plasma etching and / or deposition modules, transfer chamber, and vacuum loadlock or cassette station. Transfer chambers including handling robot are available with three to six ports. Up to two cassette stations can be used to increase the throughput. the transfer chambers can be equipped with multiple options.
Powerful control software is customized for indstrial high throughput cluster tools.
6-port cluster for industrial application
6-port cluster, including 2 SI 500 RIE ports, cassete station and
loadlock for research and development, and small-batch produce
2-port cluster, including ICP-RIE SI 500 and SI 500 C cryogenic etcher, with loadlock
Single cluster, including plasma etcher(SI 500) and deposition system(SI 500 D)
2-port RIE cluster, available for aluminum substrate etching
l Port for ICP/RIE etcher
l Port for ICPECVD/PECVD depositon system
l Loadlock
l Vacuum cassette station
l HV pump packge
