Magnetron Sputtering 磁控溅射系统

Main Characteristics

●.Economically Table Sputtering System

●.Integrating up to 5 con-focal sputtering targets at 1.5"

●.Up/down sputtering orientation

●.Deposition uniformity:+/-2.5%@3"(75mm) substrate

●.Load-lock as an option

●.Substrate temperature: 850℃; Rotation rate: 0-40rpm; DC/RF bias; Adjustable working distance with 50mm Z-type axis

●.Excellent con-focal deposition system, compatible with single- and multi-layer film deposition

●.4-way MFC gas line incorporated, reactive sputtering supported

●.Computer/semi-auto control

●.HV/UHV